来自道康宁的有机硅产品全心助您创未来
登录 | 注册信息 | 客户支持 | 联系我们
中国 - China (中文). 更改
产品查询             行业专长和技术信息             解決方案             Premier会员服务             关于道康宁
搜索
产品
解放方案
产品与销售信息
产品应用
产品信息与解决方案

灌封材料


2  3  4  5  6  7  8  9  10  11  12  >
Encapsulants Tutorial

Encapsulants (or pottants) are protective materials used to completely embed electronic circuitry. Typically, they are used to isolate circuits from the harmful effects of moisture and other contaminants, provide electrical insulation for high voltages and also protect the circuit and interconnections from thermal and mechanical stresses. Encapsulants are typically applied in thick layers--exceeding 125 mils.

Dow Corning ® silicone encapsulants are supplied as solventless, two part liquid component kits. Many are designed for 1:1 mix ratios (parts A and B).  Others are formulated for mixing at 10:1 ratios (base and curing agent). When the two liquid components are thoroughly mixed, the mixture cures to a flexible elastomer. Some products will cure at room temperature while others are designed to be cured by heat.

 A special class of ultrasoft encapsulants (Gels) also is supplied in a wide range of product offerings and is covered in another tutorial.

2  3  4  5  6  7  8  9  10  11  12  >

< 返回灌封材料首页  
 
  1. Encapsulants Tutorial


  2. Solutions for Encapsulants


  3. Key Characteristics - Encapsulants tutorial


  4. Potential Applications - Encapsulants tutorial


  5. Broad Classes of Dow Corning Encapsulants - Encapsulants Tutorial


  6. Thermal Conductivity - Encapsulants Tutorial


  7. Specialty Encapsulants


  8. Specifications and Other Qualifications


  9. Basics of Processing


  10. Curing Methods


  11. Packaging and Storage Considerations


  12. Tell Us What You Need


媒体中心    |    招贤纳士    |    站点地图    |    其它道康宁网站
使用本网站意味着您已经了解我们的保密声明并同意我们提出的条款和条件
©2000 - 2008 道康宁公司版权所有。Dow Corning是道康宁公司的注册商标。We help you invent the future 是道康宁公司的注册商标。