灌封材料

Dow Corning’s encapsulants can generally be divided into two broad classes.  Roughly half of the products have self-priming capabilities. When heated to temperatures above 100°C during the cure process, they can develop adhesion to many common surfaces. The other products can be termed as standard encapsulants. If adhesion is required, a separate priming step is needed.  For some applications, such as those where stress relief is the primary requirement, adhesion may not be as critical and standard encapsulants can be used without the need for priming. Testing in simulated or accelerated service conditions is recommended to help judge long term performance.

The table below may help with the choice of which product family best fits your process or application.

			Standard Heat Curing Encapsulants		Self-priming Heat Curing Encapsulants
	Can cure at room temp		Yes		No (must be cured above 100C)
	Cure accelerated by heat		Yes		Yes
	Room Temperature Working Time (Pot Life)		Good		Excellent
	Cure By-Products		None		Low levels of alcohols from adhesion additives
	Needs separate priming step for adhesion		Yes		No