Certain applications are uniquely sensitive and require specialized
properties of the encapsulants.
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Low Volatility Encapsulants
In some applications, low molecular weight volatiles from the encapsulants
can result in problems. This can range from volatiles re-condensing onto
surfaces negatively impacting adhesion or optical sensors or can lead to
decomposition of volatiles under high voltage conditions. For these cases,
special low volatility intermediates are used to formulate Dow Corning’s low
volatility products. One of the encapsulants is even designated as space
grade.
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Extreme Low Temperature Products
Dow Corning ® brand silicone encapsulants can withstand cold environments
down to at least –45°C(-49°F). For even colder uses, there are specialized
products that will perform down to –70°C.
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Flame Resistance
The materials used in certain applications are required to meet special
criteria such as those from Underwriters Laboratories for flammability. There
are encapsulants, which possess a UL 94V flammability classification.
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Optically Clear Materials
For optical applications, there are products that are highly transparent in
many wavelength ranges including the visible range.
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Condensation Cure Products
Most of Dow Corning’s encapsulants utilize an addition cure mechanism to
form the elastomeric network. This addition cure chemistry can be susceptible
to cure inhibition from chemicals sometimes present in electronic processes or
components. In these cases, it is recommended that condensation cure
encapsulants, which are not sensitive to inhibition, be specified for cure
sensitive applications. These materials also have an advantage of curing
rapidly at room temperature. However, they have a limited range of working
times and cure speeds and are not as versatile for processing compared to the
heat curing encapsulants.
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