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DOW
CORNING® XR-1541 E-beam Resists (PDF: 26 KB) are hydrogen
silsesquioxane resin solutions specifically formulated for research groups to
directly write the finest patterns.
They are negative acting resists available for spin coating to a range of
thin film thicknesses from 30 to 180 nm. Customized concentrations are
also available for thinner or thicker resists.
Performance Properties:
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E-beam patternable
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High resolution
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Etch resistance
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Thin films
Physical Form: Liquid solution of silicon resin in carrier
solvent
Resin: Hydrogen silsesquioxane resin
Application Use: E-beam negative resist
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