来自道康宁的有机硅产品全心助您创未来
登录 | 注册信息 | 客户支持 | 联系我们
中国 - China (中文). 更改
产品查询             行业专长和技术信息             解決方案             Premier会员服务             关于道康宁
搜索
产品
解决方案
产品与销售信息
产品应用
产品信息与解决方案

导热垫片和薄膜


Gap Filler Thermal Interface Materials Overview


(Formerly known as Heat Path™)

Potential Uses
Thermal bridge for low thermal resistance between heat sources and heat sinks of power components

Application Method
Cold applied requiring no heating or curing, material can be installed and removed easily and cleanly

Dow Corning® Brand Product

Description

Features

TP-2100 Thermal Pad

Gap filler interface Foam based thermal gel

Gap filling, foam based thermal bridge; high compressibility, soft, tacky, conformable, UL 94 HB

TP-2101 Thermal Pad

Gap filler interface Foam based flame retardant thermal gel

Flame retardant, gap filling, foam based thermal bridge; high compressibility, soft, tacky, conformable, UL 94 V-1

TP-2160 Thermal Pad

Gap filler interface Foam based one side tacky thermal gel

One side tacky, gap filling, foam based thermal bridge; high compressibility, soft, tacky, conformable, UL 94 HB

PDF Links will download files in Adobe Acrobat PDF format. For technical information, or to download the free Acrobat Reader, go to Acrobat help.

Technical Data  

Download Datasheet PDF  

< 返回导热垫片和薄膜首页  
媒体中心    |    招贤纳士    |    站点地图    |    其它道康宁网站
使用本网站意味着您已经了解我们的保密声明并同意我们提出的条款和条件
©2000 - 2008 道康宁公司版权所有。Dow Corning是道康宁公司的注册商标。We help you invent the future 是道康宁公司的注册商标。