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For Gasketing/Sealing, select one of Dow Corning's Adhesive/Sealants. Here
are some items for considerations in choosing the appropriate material for your
use:
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Dow Corning has a line of CIPG materials not covered here, please contact
Dow Corning for information on these products.
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Heat cures offer higher throughput and faster processing times. Heat cure
times typically are shorter with increasing temperatures.
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If heat cure is not practical choose a room temperature cure time that
indicates a typical time to attain full physical properties. Parts may be
handleable sooner and some of these may be mildly heat accelerable.
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One-part materials are easier to handle, two part materials often offer
faster processing. Two part materials are typically 1:1 mix ratio but some are
10:1.
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Non-slump materials with little flow are generally preferred.
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A number of these products have UL or Mil Spec approvals.
Additional Information:
Adhesive/Sealant
Product Information
Adhesives/Sealants
Tutorial
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