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SISC拥有突破性技术，与您携手，共创商机。以下为道康宁SISC专家的l论文、演讲和研讨会清单：
粘合剂
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“新型低温键合技术的硅烷分子层溶胶” A. Aziounne, F. de Buyl, J-J. Pirreaux,
Adhesion 2005, Ninth International Conference on the Science and Technology
of Adhesion and Adhesives, 7-9 September, St. Catherine’s College,
University of Oxford, UK (2005).
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“聚脂粉末化学对附着力持久性和有机硅密封剂的影响” F. de Buyl, Durability of Building and
Construction Sealants and Adhesives, ASTM STP 1453, A. T. Wolf, Ed., ASTM
International, West Conshohocken, PA, (2004).
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“未固化有机硅密封剂中的粘合促进剂和交联剂熔合” J. Comyn, F. de Buyl, T.P. Comyn,
Int.J. Adhesion & Adhesives, 23, (2003) 495-7.
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"固体-液体接触角技巧对未固化有机硅密封剂表面张力影响”, S. Springael, F. De Buyl,
"Contact Angle, Wettability and Adhesion" Vol. 2, pp317, Editor:
K. L. Mittal, VSP, Utrecht-Boston, (2002).
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“固化动力学，交联密度和烷氧基和与水反应有机硅密封剂” F. de Buyl, J. Comyn, N. E. Shephard,
N.P. Subramanian, Int.J. Adhesion & Adhesives, 22 (2002)
385-393.
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“有机硅密封剂和结构胶”, F. de Buyl, Int. J.Adhesion &
Adhesives, 21(5), (2001) 411-422.
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“硅烷偶联剂和聚合体底材交互作用” J. A. Smith, J.F. Watts, A. Goodwin, F. de
Buyl, WCARP’1-EURADH’98, Garmisch-Partenkirschen, Germany (1998).
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“有机硅密封剂阳极电镀铝底材的粘合剂” F. de Buyl, P. Descamps, EURADH’96, Cambridge,
UK (1996).
复合材料
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“硫化硅烷 – 简单或复杂的分子", M.W.Backer*, S.D. Cook, H. Yue, ISOS XIV /
3rd European Organosilicon Days, Würzburg, Germany, 31 July – 5
August 2005.
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“催化剂定相法：最新灵活且有效的硫化硅烷加工方法” S.K. Mealey*, M.W. Backer.
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“催化剂定相法合成硫化硅烷”, M.W. Backer, C.A. Buesing, J.M. Gohndrone, W.C.
Maki, T.J. Rivard, H. Yue, Polym. Prepr. 2004, 45(1),
660-1.
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“NMR 和 MS在硫化硅烷中的使用” Backer, Michael W.; Buesing, Chad A.; Dingman,
Jennifer L.; Gohndrone, John M.; Hu, Sanlin; Maki, William C.; Thomas, Bryan;
Yue, Hongjun; Mealey, Shawn K. American Chemical Society, Rubber
Division, Spring Technical Meeting, 163rd, San Francisco, CA, United
States, Apr. 28-30, (2003).
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“NMR 在硫化硅烷中的应用”, M. Backer, C. Buesing, J. Dingman, J. Gohndrone, S.
Hu, W. Maki, S. Mealey, B. Thomas, H. Yue,,Polym. Prepr.
2003,44(1), 245-6.
材料增强
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“二氧化硅填料硅树脂的热机械性能” Pierre Chevalier, Duan-Li Ou, Yeong Lee, Steven
Robson, Anne Dupont, EUROFILLERS, Brugge, Belgium (2005).
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“烷氧烷对填料分散和填料聚合物的机械性能影响” P. Chevalier, L. Stelandre, Special Chem
Web Seminar, Sept 15 (2005).
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“二氧化硅填料橡胶的动态机械性能:形态学和偶联剂影响”, L. Ladouce (Stelandre), L. Flandin, D.
Labarre, Y. Bomal, Rubber Chemical and Technology, 2003,
April.
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“水和酒精在二氧化硅增强的硅氧烷中的迁移率”, F. de Buyl, J. Comyn, Eur. Polym. J.
, 37(12), (2001) 2385-2391.
填料
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“烷氧基硅烷填料处理的过去现在和将来” S.K. Mealey, B. Thomas, Rubber
World, 233(3), (2005), 32-34,37.
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“化学反应中的二氧化硅”, P.M. Chevalier, D.L. Ou, J. Mater. Chem., 2002,
12 (10), 3003-9.
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“苯乙烯-丁二烯橡胶的二氧化硅增强中的红外二向色性和双折射研究”, L. Bokobza, L. Ladouce
(Stelandre), Y. Bomal, B. Amram, J. of Appl. Polym. Sci., 2001, 82,
1006-12.
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“苯乙烯-丁二烯橡胶的二氧化硅增强”, L. Bokobza, V. Gaulliard, L. Ladouce
(Stelandre), KGK.Kautschuk, Gummi, Kunststoffe, 2001, 54(4),
177-80.
交联剂
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“硅烷在TPE和TPVs中如何提高附着力和交联?” V. Smits, F. de Buyl, Special Chem Web
Seminar, Dec 13, 2005.
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“有机硅技术在热塑性塑料硫化中的应用” V. Smits, Th. Materne, TPE 2005, 14-15
September, Berlin, Germany (2005)
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“ROM作为潜在交联机制烷氧烷的可行性”, P. Chevalier et al.,J.Inorg. Organomet. Polym., 9(3), (1999) 151-64
溶胶凝胶
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“经溶胶凝胶 加工的多孔渗水硅氧烷-二氧化硅混合材料”, K. Noble, A.B. Seddon, M.L. Turner, P.
Chevalier, D.L. Ou, J. Sol-Gel Sci. Technol., 2003, 26(1-3),
419-423.
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“高多孔渗水混合材料新加工工艺”, D.L. Ou, P.M. Chevalier, Microporous and
Mesoporous Materials, 2003, 57(2), 133-142.
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“聚硅氧烷改性孔渗水材料”, K. Noble, A.B. Seddon, M. Turner, P.M. Chevalier,
I.A. MacKinnon, J. Sol-Gel Sci. Technol., 2000, 19(1/2/3), 807-810.
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“使用热处理或化学处理中孔或多微孔二氧化硅的混合有机官能团-无机官能团干凝胶”, P.M. Chevalier et al,
Chem. Mater., 1999, 11(2), 281-91.
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“混合有机官能团-无机官能团先驱多孔渗水二氧化硅的设计”, P. Chevalier, R.J.P. Corriu, P.
Delord, J.J.E. Moreau, M. Wong Chi Man, New J. Chem., 1998, 22(5),
423-33.
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“混合有机官能团-无机官能团化学”, P. Chevalier, R.J.P. Corriu, J.J.E. Moreau, M.
Wong Chi Man, J. Sol-Gel Sci. Technol., 1997, 8(1/2/3), 603-07.
涂料
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“烷氧基硅烷技术在涂料中的应用：回顾和前景” Th. Materne, F. de Buyl, G.Wittucki, 9th
Congresso Internacional de Tintas – ABRAFATI 2005, September 14 – 16, Sao
Paulo/Brazil (2005).
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“烷氧基硅烷在高折射率有机硅涂层中的应用” P. Chevalier, D.L. Ou, Mater. Res Soc.
Symp. Proc., Materials Research Society, 2005, 847, EE1.2.1-6.
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